Journal of Cyber Security and Mobility (ISSN: 2245-1439)

Description

Editors-in-Chief: Ashutosh Dutta, Ruby Lee & Neeli R. Prasad
Aim:
Provides an in-depth and holistic view of security and solutions from practical to theoretical aspects.Covering topics that are equally valuable for practitioners as well as those new in the field.
Scope:
This journal covers security issues in cyber space and solutions thereof. As cyber space has moved towards the wireless/mobile world, issues in wireless/mobile communications will also be published. The publication will take a holistic view. Some example topics are: security in mobile networks, security and mobility optimization, cyber security, cloud security, Internet of Things (IoT) and machine-to-machine technologies.
Steering Board
Parag Pruthi, Niksun, USA
H. Vincent Poor, Princeton University, USA
Ramjee Prasad, CTIF, Aalborg University, Denmark
Advisors
Anand R. Prasad, NEC, Japan
R. Chandramouli, Stevens Institute of Technology, USA
Frank Reichert, Faculty of Engineering & Science University of Agder, Norway
Vimal Solanki, Corporate Strategy & Intel Office,
McAfee, Inc, USA
Editorial Board
Andreas U. Schmidt, Novalyst, Germany
Debabrata Das, IIIT Bangalore, India
Eduard Jorswieck, Dresden University of Technology, Germany
Fuchun J. Lin, Telcordia, USA
Hidetoshi Yokota, KDDI Labs, USA
Jiang Bian, University of Arkansas for Medical Sciences, USA
K.P. Subbalakshmi, Stevens Institute of Technology, USA
LingFei Lai, University of Arkansas at Little Rock, USA
Mahbubul Alam, CISCO Systems, USA
Pramod Jamkhedkar, Princeton, USA
Rafa Marin Lopez, University of Murcia, Spain
Rajarshi Sanyal, Belgacom, Belgium
Rasmus Hjorth Nielsen, Aalborg University, Denmark
Reza Tadayoni, Aalborg University, Denmark
Remzi Seker, University of Arkansas at Little Rock, USA
Sateesh Addepalli, CISCO Systems, USA
Seshadri Mohan, University of Arkansas at Little Rock, USA
Subir Das, Telcordia ATS, USA
Tassos Dimitriou, Athens Institute of Technology, Greece
Tsunehiko Chiba, Nokia Siemens Networks, Japan
Wei Wei, Xi'an University of Technology, China
Yingbin Liang, Syracuse University, USA
Yoshihiro Ohba, Toshiba, Japan